pr@efctw.com
+886-3-451-4199
繁體中文
简体中文
English
About
Company Profile
Business Philosophy
R&D Technology
Quality Policy
Environmental Policy
News
Contact
Products
Semiconductor industry
Optoelectronics Industry
Health care industry
Power battery industry
Compound semiconductor testing
Power automatic module assembly solution
Investor Relations
About the Company
Financial Information
Monthly Revenue Report
Financial statement
Dividend
Investor Conference
Annual Report
Corporate Governance
Board of Directors
Functional Committee
Internal Audit
Corporate Governance Regulations
Shareholder
Meeting Notice for General Shareholders' Meeting
Shareholders' Meeting Agenda
Handbook for General Shareholders' Meeting
Contact Person
EFC Material Information
FAQ
CSR
Sustainability Report
EFC: Human Rights Policy
CSR, Diversity, Equity and Inclusion (EDI) Statement
Employee Care
Social Engagement
風險管理
檢舉制度專區
Stakeholders
Contact
Career
EFC Life
Education & Training
HUMAN RESOURCES
Group
East Field
East Field Kunshan
Product Information
Home
Products
Optoelectronics Industry
ACF Bonding Equipment
ACF Bonding Equipment
面板產業 -
FOG 全自動壓合
3-8吋FOG熱壓機(FG2004)
產品諮詢
列印下載PDF
Equipment features and benefits
Technical specifications
Attach the ACF roll in sections to the desired product location
1
Compatible with PANEL & PCB
2
Attachment accuracy X, Y ± 0.2mm
3
Multi-segment settings, multi-segment attachments
